Friday, 19 January 2024

Joint call with Korea on heterogeneous integration and neuromorphic computing technologies

Under the European Chips Act, there is a joint call between the Republic of Korea and the European Commission on heterogeneous integration and neuromorphic computing technologies for future semiconductor components and systems starting on 6 February 2024. The overall objective is to ensure security of supply for semiconductor devices.

The EU Chips Act which entered into force in September 2023 encourages European semiconductor actors to undertake international cooperation in order to ensure security of supply for semiconductor devices.

The Republic of Korea and the European Commission launched the Digital Partnership in June 2023 to strengthen the economic resilience and agreed on key outcomes to advance cooperation for an inclusive and resilient digital transformation. Both partners agreed to work on semiconductors, High Performance Computing (HPC) and Quantum technology, 5G and beyond, platform economy, artificial intelligence (AI) and cybersecurity.

Joint research on semiconductors implemented in low TRL collaborative project emerged as a concrete action in the follow-up exchanges between the European Commission and the Korean government.

Projects are expected to contribute to the following outcomes:

  • New materials, process, device, integration and design concepts for neuromorphic computing systems supporting very low energy consumption, connectivity and embedded functions for mobile applications.
  • Alternative manufacturing process technologies for semiconductor chips including frontend or backend for heterogenous integration. The technologies should sustain in the mid- and long-term the fast paced evolution of device performance, miniaturisation and cost, while reducing the environmental footprint. This includes the process of integrating individually produced chip components into a single assembly level, as well as solutions to streamline and improve this process.
  • Advanced packaging solutions aiming at heterogeneous integration of multiple functions and materials for applications in AI, communication (RF, mmW or THz), sensing, actuating, power management and active/passive device integration.


Key facts:

  • Type of Action: Research and Innovation Action (RIA)
  • Estimated EU Expenditure: 6 Million €
  • Mode: 1 stage Call with submission of Full Proposal (FPP)
  • Publication date: 06 Feb 2024
  • Deadline FPP Phase: 14 May 2024 at 17:00 Brussels Time
  • TRL: The activities must have their centre of gravity at TRL 2-4 at the end of the project.


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