PIXAPP is the world's first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line, and helps users exploit the breakthrough advantages of PIC technologies.

PIXAPP bridges the 'valley of death', providing SMEs with an easy access route to take R&D results from lab to market, giving them a competitive advantage over global competition.

Target markets include communications, healthcare & security, which are of great socio-economic importance to Europe. PIXAPP bridges missing gaps in the value chain, from assembly & packaging, through to equipment optimisation, test and application demonstration.

The development of standardised photonic packaging processes is key to increasing access and reducing the cost of manufacturing photonic devices. PIXAPP offers a menu of packaging processes to its users which cover optical, electrical, thermal, mechanical, and micro-fluidic processes.

These Building Blocks allow standardised manufacturing processes to be used across the entire supply chain. PIXAPP works with design houses, foundries, companies providing packaging services and components, and companies providing automation tools, to ensure these building blocks are suitable for pilot level assembly.

PIXAPP Launch Video

Photonics PPP Projects

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