The LOMID project (Large cost-effective OLED microdisplays and their applications) will define pathways to the manufacture of flexible OLED microdisplays with an exceptionally large area (16 mm x 20 mm, screen diagonal of 25.4 mm) at acceptably high yields (>65%).
This will be achieved by developing a robust silicon-based chip design allowing high pixel counts (1024×1280 (SXGA)) and high spatial resolution (pixel sizes of 10 μm x 10 μm corresponding to 2000 ppi). These display innovations will be coupled to a highly reliable manufacturing of the backplane.