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PLASMOfab aims to develop CMOS compatible plasmonics in a generic planar integration process as the means to consolidate photonic and electronic integration. Wafer scale integration will be used by PLASMOfab to demonstrate low cost, volume manufacturing and high yield of powerful PICs.

The new integration technology will unravel a series of innovations with profound benefits of enhanced light-matter interaction enabled by plasmonics in optical transmitters and biosensors modules

Photonics PPP Projects

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