Forecasts of the interconnect bandwidth trands in datacenters (DC) reveal that DC traffic will increase significantly while most of the DC traffic will remain within the DC in the next years. In order to achieve high-bandwidth energy-efficent and compact optical interconnects the electro-optical systems and components have to be fully integrated on chip. DIMENSION project aims for establish a truly integrated electro-optical platform. The main objectives of DIMENSION are:
- Establish a silicon platform monolithically combining BiCMOS electronics with silicon photonics and III-V photonics;
- Fully CMOS compatibility;
- Integrated devices, with CMOS, photonic and III-V functionality at the cost of silicon volume fabrication.